OmniVision has developed a technology in conjunction with TSMC that seems to offer a significant improvement in CMOS imaging technology.
In a nutshell, the OmniBSI technology inverts the sensor to collect light from the backside, which offers the most direct path for light to strike the pixel. The result is an improved fill factor, better quantum efficiency, and reduced cross-talk, hence greater sensitivity and color reproduction. Essentially, the OmniBSI architecture flips the sensor upside down so that it collects light through what had been the backside of the sensor, the silicon substrate.
