Embedded news: Week of April 28 - May 2, 2014
Collected here are my Editor’s Top Picks of embedded industry product and technology news stories for the week of April 28- May 2, 2014.
Sonics targets consumer IoT with wearable
SonicsGN SoC platcform
In new version of its SonicsGN network on chip SoC platform it addresses low latency needs for Internet of Things designs in the wearable market.
Atmel ATPL230A modem simplifies integration
of PLC for Smart Energy
Atmel Corporation has announced the release of the Atmel ATPL230A, a Power Line Communications (PLC) modem, implementing the physical layer of PRIME (power line intelligent metrology evolution) standard.
GENIVI hosting Open Automotive '14
Held in conjunction with GENIVI bi-annual All-Member meeting, the first in a series of Open Automotive '14 conferences will take place May 21 in Gothenburg, Sweden it will discuss impact of IoT on automotive connectivity.
AMD targets mobile graphics with Mullins
and Beema SoCs
The Mullins and Beema SoCs feature a switchable graphics mode to optimize performance and power, with almost double the graphics performance as the previous generation.
Wind River beefs up Linux security for IoT
Wind River Adds Security Boost for the Internet of Things to its Linux distribution
Get hands-on experience with embedded
Traveling technology events such as the free Renesas 2014 DevCon Extension tour are a good way to get hands on experience with embedded technology tools and to interact with fellow engineers and developers.
New video compression protocol for mobiles,
The Video Electronics Standards Association (VESA) and the MIPI Alliance announce the finalization and availability of the Display Stream Compression (DSC) Standard, version 1.0.
Imagination's WebRTC media engine enhances
Imagination Technologies introduces an innovative WebRTC media engine that promises to deliver a new level of quality to companies building native or browser-based voice and video conferencing services based on WebRTC.
Microchip's digitally enhanced power analog
controllers boast integrated MCU
Microchip has expanded its Digitally Enhanced Power Analog controller product line with the introduction of the MCP19114 and MCP19115 controllers supporting flyback, boost, and SEPIC topologies.
ATCA System Management Software speeds
integration of complex systems
Artesyn Embedded Technologies has announced System Services Framework (SSF), a new software solution for its ATCA systems.
TI brings Bluetooth Smart to autos for
smartphone and wire-replacement
TI has announced the SimpleLink Bluetooth low energy CC2541-Q1, a highly-integrated wireless microcontroller (MCU) that delivers low power, low cost, and simplified automotive connectivity.
New PXIe Backplane from Elma integrates
PCIe into PXI
Elma Bustronic's new 3U 17-slot backplane meets the PXI Express Hardware Specification Revision 1.0 (with X1 PCIe connections).
IAR adds stack usage analysis to Embedded
Workbench for Renesas RX
Version 2.60 of IAR Systems' development toolchain IAR Embedded Workbench for RX contains stack usage analysis functionality and several other new features that make the toolchain for Renesas RX microcontrollers even more powerful.
ILS and Jasper team to help mobile
operators deliver IoT apps
ILS Technology and Jasper have expanded their collaboration to help mobile operators deploy successful IoT initiatives on the Cloud-based Jasper Platform and the deviceWISE Application Enablement Platform (AEP) from ILS Technology.
Multi-Tech Multiconnect OCG Router is now
ILS Technology and Multi-Tech have collaborated to make Multi-Tech’s MultiConnect OCG “deviceWISE Ready” by embedding the deviceWISE agent directly into the OCG firmware.
Embedded news and commnntary from around the Web
Basic Turns 50
Top Free DIY Tools Every EE Needs
World's Smallest Mixed-Signal FPGA EE Times
Google's Project Tango Features Apple Chip
Is It Secure to Use BLE in Cars
Bluetooth Smart What's in a Name
Auto Infotainment Still 'Bugs' Luxury Vehicles
Energy Harvesting Needs New Tools
Imagine a world without cords
IBM Unveils Power8 Chip As Open Hardware
IBM's 3D Printer to Revolutionize Chip Prototyping
Warp Drive Research Key to Interstellar Travel