Wafer-bump reflow system speeds process with three-belt transport design
FULLERTON, Calif.--Radiant Technology Corp. here announced a new wafer-bump reflow oven architecture that speeds up the process and lowers the risk of contamination by using three separate conveyor belts to move wafers through the system.
The new Continuous Conduction Wafer Bump Reflow Oven has been designed to address a number of problems in current systems, including lost production time while hot plates heat up or cool down. It also eliminates the need to push wafers from stage to stage, which can cause contamination, said Radiant. During the reflow process, flux residue often accumulates on hot plates, which can cause wafers to become contaminated, the company said.
In addition to the three separate conveyor belts used to transport wafer through the reflow oven, the new model WB-615 system has a self-cleaning feature that eliminates the need to stop production to clean flux reside.
"Our new oven has all the advantages of hot plate reflow systems currently available for this industry, but eliminates the disadvantages of these systems while also providing the traditional atmosphere control benefits of Radiant Technology ovens," stated Carson T. Richert, president of the Fullerton company, which recently demonstrated the wafer-bump reflow system at the HDI Expo trade show in Mesa, Ariz.