Darnell calls for papers for Digital Power Forum
Corona, California—Darnell Group has issued a Call for Papers for the fifth annual Digital Power Forum (DPF '08) at the Hyatt Regency, San Francisco Airport (Burlingame, Calif.) on September 15-17.
"We have established a unique and comprehensive community of delegates at the Digital Power Forum," said Jeff Shepard, president of Darnell Group. "The fact that we've been able to have both the Critical Facilities Roundtable, an organization of data center operators, and the Institute of Data Center Professionals as Supporting Sponsors of the Digital Power Forum for multiple years demonstrates the breadth and depth of our engagement with all levels of the power community."
Hundreds of power and system design engineers, engineering managers, research and development directors, and executive managers are expected at the conference to discuss and debate the latest practical advancements related to digital power control techniques in electronic systems and power converters, and digital energy management and power management in enterprise-level installations and related digital equipment.
Papers for the conference are sought in the following areas:
Power Conversion Track topics include controllers and control loops, communications, fault tolerance, stability analysis, converter efficiency, design tools, topologies, system partitioning between analog & digital, power quality and EMC. Application areas include AC/DC power supplies and DC/DC converters, telecommunications rectifiers, inverters, uninterruptible power supplies, and lighting ballasts.
Digital Power Management Track topics include improved system availability, voltage sequencing, hot plugging, fault monitoring, power management, distributed power architectures, system configuration, and communications. Application areas include networking and communications systems, computing and storage systems, industrial, medical, portable computing, and communications devices.
Advanced Power Conversion Components Track topics include semiconductor devices (MOSFETs, IGBTs, FREDs, Schottky devices, etc.) packaging, interconnect, thermal management, capacitors, magnetic materials and devices, and other components that enable the design and implementation of leading-edge power converter designs.
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