MEMS foundry licenses out TSV technology

November 7, 2011


LONDON – MEMS foundry Silex Microsystems AS has said it has licensed its Sil-Via technology for through silicon vias (TSVs) to Nanoshift LLC for use in the early development of complex MEMS products.

"Through this license, MEMS customers can leverage Silex’s extensive experience in MEMS, and capitalize on Nanoshift's highly-skilled design and development teams to more rapidly bring their MEMS products to market," said Peter Himes, vice president of marketing and strategic alliances for Silex Microsystems (Jarfalla, Sweden), in a statement.  

"The Silex Sil-Via platform has become the go-to TSV technology in the MEMS industry because it has been proven in many high-volume applications," said Salah Uddin, co-founder of Nanoshift (Emeryville, Calif.), in the same statement.


Related links and articles:

www.silexmicrosystems.com

www.nanoshift.net

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