Report: Nikon to work with Intel to develop 450-mm wafer steppers

Junko Yoshida

August 7, 2012

Junko Yoshida

NEW YORK -- The Nikkei Shimbun, Japan’s economic newspaper, reported that Nikon Corp., the world’s number two stepper manufacturer, is going to work with Intel Corp. to develop the next generation semiconductor manufacturing equipment capable of handling 450-mm wafers.

The report said that Nikon plans to commercialize it by 2018.

How much financial support Intel will provide to Nikon is unclear. The Japanese newspaper reported that Intel “has apparently decided to shoulder tens of billions of yen in development costs for Nikon.” 

Chuck Mulloy, a spokesman for Intel, said the company is not commenting on the Nikkei report at this time.

Earlier in July, Intel  agreed to acquire a 15 percent stake in ASML Holding NV as part of a $4.1 billion deal to accelerate the development of extreme ultraviolet (EUV) lithography and technology needed for the looming transition to 450-mm wafers.

The $4.1 billion includes about $2.1 billion in equity investment in ASML, good for 10 percent of ASML's shares, Intel said. The company said it also committed to buy another 5 percent of ASML's shares for about $1 billion in the relatively near future.

Earlier this week, foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. announced it would take a 5 percent stake in ASML as part of a similar arrangement.

Related stories:

-Intel buys stake in ASML to boost 450-mm, EUV R&D

-ASML won't get fooled again