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Congatec partners with Adeneo for BSPs

November 14, 2012

colin.holland-November 14, 2012

Congatec AG is working with with Adeneo Embedded to deliver ready-to-use board support packages for the Freescale ARM Cortex A9 i.MX 6 Series based modules. The software partnership is aimed at providing end-to-end solution\to speed up the development of Windows Embedded and embedded Linux devices.

Adeneo Embedded provides embedded operating system integration with facilities in Europe and the US. It is a member of the Freescale "Design Alliance" program and the official partner of Freescale for Windows Embedded Compact, Android and Embedded Linux developments on i.MX architectures.

Leveraging Adeneo’s software and system integration expertise for ARM Freescale processors, Congatec initially offers BSPs for the conga-QMX6 Qseven modules based on the ARM Cortex-A9 Freescale i.MX6x series. Sporting a sophisticated high-end, 3D-ready HD graphics core, the conga-QMX6 Computer-on-Modules (COMs) are designed for advanced multi-media applications. Target markets include manufacturers of mobile and ultra mobile industrial devices as well as medical, automotive and industrial automation.

"As the official embedded system integration partner of ARM silicon vendor Freescale and with special expertise in advanced multi-media application development, Adeneo Embedded has the perfect background and experience to help us complement our ARM-based board support offering," explains Gerhard Edi, CEO congatec AG.

The standard conga-QMX6 BSP includes support for the universal boot loader (uBoot), Linux and Windows Embedded Compact 7. WEC 7 Binary BSP files and Linux source code are available free of charge; a one-time licence fee applies for WEC7 source code.

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