Electronica: TI, SOM vendors team on OMAP industrial apps
At Electronica in Munich, Germany, TI took a step toward moving its OMAP processor into the embedded market with the announcement that it is teaming with six system-on-module (SoM) vendors on the implementation of modules designed to simplify and speed industrial development.
Using Texas Instruments dual-core ARM Cortex-A15 architecture which is complemented by an integrated DSP, dual Cortex-M4 cores and various on-chip accelerators, the modules being planned include systems from : Embedded++ (EPP-Pico-OMAP5430 module), GreenBase (GK-5432 module), Jorjin (APM-5 module), Phytec (phyCORE-OMAP5430 SOM module) and SECO (µQ7-OMAP5 module)
“TI is committed to the expansion of OMAP processors into industrial applications that require long product life cycles, extended temperature and reliability, and real-time control and communication,” said Debasish ‘Ron’ Nag, manager of TI’s OMAP industrial business.
The OMAP 5 architecture keeps power levels low to decrease utility costs and brings the best of ARM’s Cortex-A15 performance to advanced industrial systems, delivering: dual ARM Cortex-A15 MPcores for high-performance application processing, dual Cortex-M4 cores for efficient task offloading and power optimization, integrated DSP for flexible, high-performance, real-time processing analytics and control, on-chip accelerators for vision, full-HD video (1080p) and 2D/3D graphics and industrial temperature qualification (-40 to +85°C).
The new OMAP 5 processor based modules are expected to be available to select customers in first quarter of 2013 from TI’s SoM partners.