Rugged COM Express Type 6 Modules feature removable memory
Acromag’s XCOM-6400 COM Express Module provides a high-performance processor in a package that is small, light, and power-efficient. The XCOM-6400 is a Type 6 Basic COM Express module that is available with a choice of Intel’s 4-generation Core i7 or i5 Haswell CPU and Intel’s 8-Series QM87 PCH chipset, formerly known as Lynx Point. A SODIMM hold-down method ensures secure connections while still allowing users to remove or upgrade the memory. The new module is designed for defense, aerospace, and industrial applications and features an extra-thick circuit board, advanced thermal management, and extended operating temperature ranges.
The XCOM-6400 provides heat sink capabilities not available on traditional COM Express designs. Conduction-cooled rails establish a new design opportunity for carrier cards. Additional heat management technologies include heat spreader plates plus options such as cooling fins and a fan. Shock and vibration are minimized by implementing a SODIMM hold down mechanism - soldering down the memory is no longer necessary A screw-down latch securely fastens the memory in place to prevent it from shaking loose and also serves as a conduction plate to help wick away heat. Removing the latch provides user access to two memory slots that support up to 16GB of high-speed DDR3L available in 1 x 4GB, 2 x 4GB, and 2 x 8GB configurations.
The 4th generation of Intel’s Core i5 and i7 processors (codename Haswell) delivers performance improvements for floating-point-intensive computations, which are critical for digital signal and image processing applications like radar and sonar. Enhanced graphics enable smoother playback of high-quality images. Better power efficiency reduces heat and allows smaller, lighter, more portable designs. Acromag offers a high-performance quad core i7 CPU (2.4GHz, 47W) and more efficient dual core i5 CPU (1.6GHz, 25W).
The platform controller hub is Intel’s 8-Series QM87 PCH chipset (codename Lynx Point) which provides faster connectivity and flexibility with integrated I/O technologies. For graphics, the module uses an Intel integrated graphics processor with support for a 3x digital display interface (DVI or DisplayPort) and eDP interface (x2). Audio is supported through an HDA interface. The LAN Port is a Gigabit Ethernet Medium Dependent Interface (MDI). Other I/O interfaces include four SATA III ports (6 Gb/s), a PEG / general-purpose PCIe x16 interface with bifurcation/trifurcation support, four USB 3.0/2.0 ports, and four USB 2.0 ports. Users can access the SPI bus, LPC bus, SMBus (system), and I2C (user). There are also four general-purpose outputs and four general-purpose inputs. Security and encryption capabilities are facilitated through use of a Trusted Platform Module (TPM).