Latest News
Headlines for Wednesday, February 8, 2012
Technology
Next-gen video codec hits milestone
Business
UMC to boost 2012 capex to $2 billion
Rebuilding America: Silicon Valley is back
APEC: Linear Tech's perspective
SEMI Europe symposium to review IC industry goals
Nokia: No "Plan B" should Windows Phone fail
Nokia shifts assembly to Asia, plans to lay off 4,000
Product
Conexant has 32-bit processor for hi-performance audio
ST adds 32-bit MCU to 9-axis inertial sensor
Cavium, Freescale roll embedded processors
Headlines for Tuesday, February 7, 2012
Technology
SIA makes public technology roadmap
Cree claims LED price-performance breakthrough
User interface firm offers OpenCL benchmarking tool
Researchers develop novel form of hafnium oxide
Business
India wafer fab decision expected by end of 2012
Commentary: Japan Inc. faces choppy seas
VC Kleiner Perkins launches engineering student fellowship
Intel’s Romley poised to roil data center
FujiPanaRene: clinging to the wreckage
Nikkei: Japanese firms look to merge system IC units
LTE femtocells ready to take off as API ecosystem expands
Mindspeed completes acquisition of Picochip
Mindspeed completes Picochip acquisition
Plessey buys Cambridge spin-off for HB LEDs
Design
Kilopass NVM IP qualified at 130-nm at TowerJazz
Product
Transphorm announces GaN products at 600-V
Headlines for Monday, February 6, 2012
Extra!
Questions Cloud Outlook at 'New' AMD 
Business
Veeco sees no near-term uptick in LED market
BlackBerry PlayBook sees further price cuts
Rambus buys memory startup for $35 million
Global chip sales squeeze 0.4% annual growth
Intel terahertz supplier secures $5.5 million funds
Technology
Product
Broadcom RFIC shrinks microwave backhaul nets
Career
Reports: trace carcinogens found in Korean wafer fabs
Headlines for Sunday, February 5, 2012
Technology
Big Switch releases open source controller for OpenFlow
Headlines for Saturday, February 4, 2012
Business
Appleton's death could delay DRAM consolidation
Headlines for Friday, February 3, 2012
Business
New IBM CEO sees her salary doubled
IBM SmartCamp startups attempt to solve world problems
Micron's Steve Appleton dies in plane crash
Panasonic predicts loss of $10 billion for fiscal year
Sonics, Tensilica team to improve IP efficiency
Microchip posts weak fiscal Q3, outlook brighter
Extra!
ARM Mulls Non-Volatile Memory IP acquisition
Product
STMicro extends appliance control offerings
Headlines for Thursday, February 2, 2012
Business
NXP gives sneak peek at new engineering workbench app
Video: HP's Prith Banerjee discusses HP labs, ARM servers and optical interconnects
AMD: New faces, new road maps, new focus
Elpida posts big loss, denies Micron deal
ASPs weigh as Hynix' losses reduced in Q4
CMOS timing startup raises $2.3 million
Infineon profits trimmed by lower sales
TSMC plans 3-D IC assembly launch early in 2013
Cadence a billion dollar company once again
U.S. probes Qualcomm's foreign business practices
Conferences & Shows
Rick Merritt DesignCon wrap up; 3D stacking, optical interconnects
Technology
HP rolls OpenFlow code for its switches
U.K. to spend $120 million on graphene institute
CNSE receives federal grants for nanotechnologies
Qualcomm, Ericsson demo LTE-to-3G handover
What's new at EE Times
Recommend us:
Follow EE Times:
Download:
Digital Edition
PDF
New!
Rebuilding America
A manufacturing revival is key to fixing the U.S. economy.
Most Popular
Datasheets.com Parts Search
185 million searchable parts
(please enter a part number or hit search to begin)
Launch Box
|
EE Times at DesignCon |
|
Visit Microcontroller Central |
|
Video Design Ideas |
|
Visit Scope Junction |
|
Want to win an electric car? CLICK HERE |
