Digi International has introduced a comprehensive Smart Energy product family, including ZigBee Smart Energy-ready modules and certified Energy Service Portal (ESP) gateways built on these modules. XBee-PRO SE modules feature firmware that simplifies the development work required to develop and certify a ZigBee Smart Energy device. The ConnectPort X2 ESP gateway provides the connection between a consumer's HAN and an energy service provider over a broadband or cellular connection.

Member companies of the ng Connect consortium, formed to aid the rapid deployment of broadband services based on Long Term Evolution (LTE) and other high bandwidth technologies, demonstrated at the recent IEEE International Conference on Communications (ICC) conference in Dresden, Germany, live intercontinental transmission of a multi player game using LTE.

Global sales of semiconductors rose to $16.5 billion in May, an increase of 5.4 percent from April when sales were $15.6 billion, according to the Semiconductor Industry Association (SIA). May sales were 23.2 percent lower than May 2008 when sales were $21.5 billion.

Researchers at the University of Southampton's School of Electronics and Computer Science have received a $578,623 funding to develop reliable low power computing systems.

ENEA has signed a deal worth approximately 10 million Swedish Kroner (about $1.3 million) to provide multicore technology for use in mobile infrastructure equipment to an unnamed tier 1 telecom supplier.

The insides of the new Flip UltraHD, while leading edge, are not quite as interesting as the questions surrounding Cisco's acquisition of its developer, Pure Digital. Yet, the deal closed and the Flip continues to outsell all competitors, but maybe not for long.

The Apple iPhone 3GS has a bill of materials cost of $172.46, and Toshiba took the largest share of the pie at $24 for its 16 Mbyte flash module, according to market watcher iSuppli Corp.

In this blog posting, Apple has gone to great lengths to make the iPhone 3G S "greener". Will a teardown, reveal those lengths?

The Apple iPhone 3G S has been torn apart to identify what was inside. Impressions on the phone.

Teardowns of the third generation Apple iPhone reveal a more integrated—and probably lower cost--handset thanks in part to new design wins for Broadcom and Toshiba that caused one analyst to quip the 'S' in the iPhone 3GS may stand for savings.

Use this VirtuaLab to learn the features of the new Luminary Micro LM3S101 microcontroller. Develop software with your choice of ARM/Keil RealView Microcontroller Development Kit or CodeSourcery G++ GNU development environment. In addition, complete example code and driver libraries including a port of FreeRTOS from FreeRTOS.org.

Use this VirtuaLab to learn the features of the new Luminary Micro LM3S811 microcontroller. Develop software with your choice of ARM/Keil RealView Microcontroller Development Kit or CodeSourcery G++

Use this VirtuaLab to learn the features of the new Luminary Micro LM3S811 microcontroller. Develop software with your choice of ARM/Keil RealView Microcontroller Development Kit or CodeSourcery G++