The series includes one 250-V, 1-A device, the TPD4121K, and eight 500-V devices with output current ranging from 1 A to 3 A. The series provides designers with a selection of integrated functions to meet various application requirements, including Hall sensor input or six inputs, three phase matrix logic, power management circuits, level shift drivers, over current protection, over temperature protection and under voltage protection.
The high-voltage IPD single chip inverters use silicon on insulator (SOI) process to enable use of the DIP26 package, which has a maximum thickness of 3.8 mm, more than 25 percent thinner than the previous generation 5.2-mm (max.) F23 package. Each of the nine devices incorporate bootstrapping diodes, so no high-side driving power is required. For ease of layout on a printed-circuit-board, high-voltage power pins and low-voltage signal pins are on opposite sides of the package. The control pins have a pitch of 2.0 mm and the high-voltage pins feature a wide clearance of 3.8 mm.
Toshiba America Electronic Components is exhibiting at APEC, Booth 112-11.
Pricing: Sample prices range from $5.00 for the 250-V, 1-A TPD4121K to $9.00 for the 500-V, 3-A TPD4125AK.
Availability: Samples are available now. The TPD4124K and TPD4124AK are scheduled to begin mass production in the second quarter of 2008. The other seven inverters are beginning mass production now.
Toshiba America Electronic Components, Inc., www.toshiba.com/taec