AdvancedMC module provides high bandwidth in compact package - Embedded.com

AdvancedMC module provides high bandwidth in compact package

Loughborough, United Kingdom—CommAgility announced its AMC-D1F1-1200, a high-performance, mid-sized AdvancedMC module that includes a Texas Instruments (TI) TMS320C6455 DSP running at 1.2 GHz and a Xilinx Virtex-4 FX100 FPGA.

The AMC-D1F1-1200 module is optimized for applications requiring high-end signal I/O bandwidth in a compact mid-height AMC form factor, such as wireless baseband, image processing, defense and aerospace.

The AMC-D1F1-1200 provides a combination of DSP and FPGA resources, with fast and flexible links to external data and over 256MB of on-board memory. The FPGA is directly connected to the DSP via a high bandwidth, low latency 64 bit, 150MHz local (EMIF) bus to facilitate co-processing. The processor elements are also interconnected by a 10-Gbit/s SRIO infrastructure with external connectivity to an AMC.4 backplane interface and front panel connector. An AMC.2 Gigabit Ethernet interface is also supported.

For applications requiring custom I/O or specialized additional processing, a mezzanine module can be fitted to the AMC-D1F1-1200. The mezzanine can include front panel connectors as well as direct interfaces to Ethernet, SRIO and the FPGA.

The module is based on the AdvancedMC embedded standard, making it suitable for use in MicroTCA and AdvancedTCA systems. The product is designed to be used in NEBS and ETSI compliant systems.

Pricing: Provided on an individual basis for each customer.
Availability: Sampling to lead customers now.
Datasheet: Click here.

CommAgility, www.commagility.com

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