Over 25 companies have signed up provide support and technical contributions towards the development of the next generation of the AMBA on-chip interconnect specification.
The AMBA 3.0 technology will be available for public release in the first quarter of next year and has input from a number of companies including: Agere Systems, Agilent, Atmel, Cadence Design Systems, Conexant Systems, CoWare, Infineon, LSI Logic, Mentor Graphics, Micronas, Motorola, NEC Electronics Corporation, NEC Electronics, Philips Semiconductors, Samsung, STMicrocroelectronics, Synopsys, Toshiba Corporation, Verisity.
Mohamed Ben-Romdhane, IP director, Conexant Systems, said, “The participative nature of the AMBA 3.0 Program has ensured that the new specification will further increase both the flexibility and the performance of the protocol and yield a cross-platform adoption.”
Rafi Kedem, senior director of processor cores technology group at LSI Logic, added, “AMBA 3.0 technology introduces new capabilities not just at the protocol level but also to ease physical implementation of the bus in deep sub-micron technologies These new features will likely expand the adoption of AMBA beyond just next-generation processors SoC subsystems to other application specific areas with high-bandwidth and low-latency requirements. LSI Logic is already implementing targeted peripherals and subsystems based on the draft AMBA 3.0 standard.”