LONDON AMD has added two dual-core, 18W thermal design power (TDP) processors to its ASB1 BGA embedded client platform.
TDP represents the maximum amount of power the cooling system in a computer is required to dissipate.
The AMD Turion Neo X2 processor model L625 and the AMD Athlon Neo X2 processor model L325 are designed to provide PC performance in a low power envelope and with an embedded-friendly ball grid array (BGA) package.
AMD says that and embedded system providers IBASE (Taipei, Taiwan) and IEI Technology Corp. (Pomona, Calif.) should be among the first to introduce products based on the processors.
The embedded client solution is suitable for traditional embedded applications such as single board computing and thin client systems, as well as markets for self-service kiosks, point of sale machines and digital signage.
The BGA package should reduce reliability issues for systems that are deployed in rugged environments and has a low z-height that is designed to enable thin, compact enclosures.
When combined with either the AMD 780E or M690E chipset, embedded system designers can take advantage of a complete x86-based solution.
All of AMD's embedded products are offered with industry-standard 5-year component longevity.
“With the AMD Athlon Neo X2 processor, AMD is offering us a new CPU option that improves on the punch of the single core predecessor with a mere 3 watts increase in processor power consumption,” said Dwight Looi, product manager, IBASE Technology. “There is no 18 watt processor on the market that offers our customers precisely the same combination of power efficiency, performance and value, making it a natural choice for our embedded applications.”