Apacer showcases solutions for transportation applications at InnoTrans 2018 - Embedded.com

Apacer showcases solutions for transportation applications at InnoTrans 2018


Apacer is participating at InnoTrans 2018 in Berlin, showcasing its latest industrial products and technologies for transportation applications, including industrial 3D TLC NAND SSD solutions, CoreVolt technology, TCG Opal 2.0 solutions, and extremely rugged XR-DIMM solutions.

In response to the rapid growth in need of higher capacity with enhanced performance for transport industrial flash storage solutions, Apacer is launching brand new industrial 3D TLC NAND solutions that adopt 64-Layer BiCS3 structure and are equipped with Over-Provisioning technology to help optimize SSD performance, alleviate memory wear and prolong SSD lifespan. The ability to operate within a wide range of temperatures means that even under severe conditions, Apacer 3D TLC NAND SSD products will still maintain outstanding performance.

Apacer’s proprietary CoreVolt technology is composed with special hardware circuit design and is specifically to stabilize SSD’s data read/write operation for enhancing data protection in real time. It is ideal for the transportation applications hence there is no interruption in data transmission when system voltage instability occurs.

Amidst the continuous advancement in the storage technologies of SSDs, choosing products that can store an immense amount of data securely has become the priority of many companies. Apacer offers a variety of products with the TCG Opal 2.0 technology. TCG Opal 2.0 SSDs handle the encryption of information within the device without the need for a host, enabling fast encryption and minimizing the risk of data leakage without affecting system performance. Apacer’s TCG Opal 2.0 products come in a variety of form factors, including 2.5″, M.2, mSATA, and MO-297. 

Apacer’s XR-DIMM uses the innovative board-to-board connector design to fit tightly and securely onto the motherboard. In addition, it adopts the highly durable 300-pin connector and mounting holes to effectively prevent memory modules from dislocating or coming away due to vibration or shock. This greatly improves the reliability of memory signal transmissions, serving as the strongest support for transportation applications. Its connector design meets the anti-vibration and anti-shock standards of MIL-STD-810 and ANSI/VITA 47-2005. Furthermore, it supports underfill, anti-sulfuration, conformal coating, and wide temperature technologies which ensure stable operation of the product under severely cruel environments. Apacer’s XR-DIMM is compatible with DDR4 2133/2400 specification, supports ECC function and comes in two capacity choices of 8 GB and 16 GB.

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