Atmel launches new LIN family for in-vehicle networking - Embedded.com

Atmel launches new LIN family for in-vehicle networking

Atmel Corporation has launched its next-generation family of local interconnect networking (LIN) transceivers, system basis chips (SBC), and voltage regulators for automotive body, power-train, infotainment sensor, actuator applications and more. The new family is the industry’s first to comply with the new original equipment manufacturer (OEM) hardware recommendations and provide scalable functionality to improve the overall system cost.

All the new devices in this new family feature an LDO with outstanding minimum supply voltage of 2.3V combined with linear mode current of 130uA to support data storage even during an unexpected shut down. This new family is compliant with the latest standards including LIN 2.0, 2.1, 2.2, 2.2A and SAEJ2602-2. Some members of the family also include application specific functions such as relay drivers, watchdog, high-side switches and wake up inputs to enable system designers to build innovative in-vehicle network applications in next-generation automobiles.

The devices are available in DFN packages with heat-slug and wet-able flanks to support optical solder inspection. These next-generation devices also provide a family package footprint so that designers can upgrade their designs with various devices within the LIN SBC family.

Key Features

  • + 3.3V/5V/85mA LDO suitable for usage with low-cost multi layer ceramic capacitors
  • 2.3V lowest operating voltage
  • Very low current consumption in linear mode (2V < VS < 5.5V): typically 130µA – supporting emergency data write back to Flash in an unforeseen shut down situation
  • Sleep current <15µA; Normal mode current <290µA
  • DFN 8 (3x3mm) and DFN16 (3*5.5mm), wet-able flanks included, allowing automatic optical inspection of the solder joint

More information

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