Brian Santo is a technology writer who for the last three decades has covered various aspects of the electronics industry for EE Times, IEEE Spectrum, SNL Kagan, CED, Light Reading, and Electronic Products.
SAN FRANCISCO –Google is experimenting with machine learning (ML) to perform place-and-route in IC design and is getting great results. The revelation, announced last week…
CES 2019 provided more evidence of companies making decisions on Internet of Things (IoT) connectivity. Bluetooth and Wi-Fi seem to be prevailing. If IoT connectivity…
This story is part of an AspenCore Special Project on the Semi-Autonomous Motorcar technology. Check out the other articles in this Special Project: SAM Technology…
BrainChip Holdings Ltd. Claims that it’s the first company to deliver a spiking neural network (SNN) architecture to market. The company will begin sampling its…
Last year, the Raspberry Pi Foundation delivered the third model of its professional-grade Raspberry Pi board. The Compute Module 3 (CM3) is a testament to…
Microsemi Corp. has created lower-power versions of its PolarFire field-programmable gate arrays (FPGAs) and simultaneously released an updated version of its design suite that supports…
NXP Semiconductors has added a set of timing and connectivity components from Abracon LLC to its NXP Rapid IoT Prototyping Kit. The Abracon parts should…
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