Deployment of Google Anthos bare metal can help enable deployment of any containerized service to the mission critical edge without compromising security or performance. This article takes a look at how services such as Google Cloud Visual Inspection AI service can be implemented to provide a validated solution for secure, video-based quality inspection.
This week’s embedded news features AMD collaboration with ECARX for digital cockpits, lidar news, plus more.
The Nvidia Jetson AGX Orin 32GB production module is available now from over 30 technology providers in the Nvidia partner network.
The new Titanium Ti180 FPGA offers three times the logic density over its existing products for embedded computing applications, offering 180k logic elements in a 10mm x 10 mm footprint.
The complementary field-effect transistor (CFET) is an attractive device architecture for scaling beyond 1nm logic technology nodes. This article evaluates two integration schemes, with proposed process flows for sequential CFET.
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This week’s roundup of news from the world of embedded systems design and development.
Cooperation targets new generation of Volkswagen vehicles based on unified and scalable software platform, plus TSMC will manufacture the SoC wafers for ST, and CARIAD gets to secure chip supply for the Volkswagen Group’s cars years in advance.
First modular Micro-ATX compliant carrier board with COM-HPC interface now supports OEMs looking to develop designs lasting at least 7 years,
A DevOps-style device feedback loop can be an invaluable tool for monitoring the safety and security of distributed equipment across the industrial internet of things, or Industry 4.0
A brief summary of some of my interactions at the 59th Design Automation Conference, DAC 2022, held recently in San Francisco.