Siemens Digital Industries Software has been busy adding to its IC verification portfolio, with the acquisition of Fractal Technologies and OneSpin Solutions. The integration of…
Samsung Electronics has announced availability of its newest integrated 2.5D packaging solution, Interposer-Cube4 (I-Cube4), incorporating four high bandwidth memory (HBM) dies and one logic die…
MikroElektronika (MIKROE), the inventor of the 16-pin mikroBUS standard said it has launched its 1,000th Click board, EtherCAT Click, which enables EtherCAT functionality to be…
At the Shanghai Auto Show this month, Ambarella said that automotive manufacturer Great Wall Motors’ (GWM) new WEY Mocha flagship sports utility vehicle (SUV) uses…
Xilinx has taken a big step towards enabling wider market adoption of edge artificial intelligence (AI) and particularly embedded vision by entering the system on…
With chip design becoming increasingly complex with multiple components and technologies coming together in hyper-convergent integrated circuits (ICs), a single system approach to analyzing the…
Automotive driving software and intellectual property company AImotive said it has successfully demonstrated automotive neural network vision applications executing at up to 98% efficiency on…
Katana Graph, a high-speed graph analytics startup focused on processing large unstructured data sets, announced it has optimized its graph engine for the new 3rd…
TORONTO—Sometimes a problem can become its own solution. For CEA-Leti scientists, it means that traits of resistive-RAM (ReRAM) devices that have been previously considered as…
Arm has launched its first new architecture in a decade, Armv9, which address security through a new confidential compute architecture (CCA) and the ever-increasing artificial…
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