CEVA inks DSP core foundry deal with UMC - Embedded.com

CEVA inks DSP core foundry deal with UMC

TAIPEI — DSP core provider Ceva, Inc. has extended its foundry reach to United Microelectronics Corp., adding its Teak and TeakLite DSP cores to the IP line-up at the second largest pure-play foundry.

Through the arrangement, Ceva is hoping to target UMC's large, Asia-based clientele, many of whom focus on communications applications. “Our Teak and TeakLite DSPs available under a foundry license promises to increase our penetration in cellular markets, and expand (market share) in the emerging arena of digital multimedia applications,” said Derek Myer, vice president of business development for Ceva.

The announcement is another step forward for Ceva's new strategy. Last month, the company dropped its old name, ParthusCeva, and shed its reputation as a general IP provider. Ceva now focuses on programmable DSP core licensing and is highlighting a new high-performance core, the Ceva-X1620, formerly known as “Cedar.”

This item has already run on EETimes.com

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