Chip sets are designed for HSDPA and ultra low-cost segment - Embedded.com

Chip sets are designed for HSDPA and ultra low-cost segment

The S-GOLD3H is the heart of Infineon's next-generation mobile multimedia platform, which it calls the MP-EH, supporting HSDPA (High-Speed Downlink Packet Access) data rates of up to 7.2 Mbits/s. Other components of the MP-EH are a power management chip SM-Power3; a RF transceiver SMARTi 3GE; a six-band WCDMA and quad-band EDGE RF transceiver; a “Bluemoon UniCellular” chip for Bluetooth connectivity; an A-GPS (Assisted GPS) positioning single-chip “Hammerhead;” as well as a WLAN low power chip called “Wildcard LP.” The S-GOLD3H supports GSM, EDGE, GPRS and WCDMA mobile phone networks.

The E-GOLDvoice chip is the heart of Infineon's second-platform generation for ultra-low-cost handsets, ULC2. The new chip includes the baseband processor, the RF transceiver, SRAM memory, and power management. Compared the ULC1 platform now offered by Infineon, this platform can lower the bill-of-material costs for an ultra-low-cost mobile phone by about 20%, to around $16. E-GOLDvoice shrinks the space required for the electronics in a mobile handset with basic functionality to just 4 cm2 . Further information is available at www.infineon.com.

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