COM Express module with GS45 chipset - Embedded.com

COM Express module with GS45 chipset

Munich, Germany – The new COM Express-module family CXC-GS45 (95 x 95 mm) offered by MSC is fully compliant to the COM Express Type 2 specification. The platform is based on the recently announced devices in small form factor (SFF) from the Intel Embedded Low Power Roadmap. In conjunction with single-core and dual-core processors built in 45nm technology, the Intel GS45 Graphics and Memory Controller Hub (GMCH) and the enhanced Intel I/O Controller Hub (ICH9-M) have been implemented. Performance leaps of up to 300% – compared to the previous platform – are expected to be achieved by means of the new architecture and higher clock speeds of the front-side bus, memory and graphics.

COM Express SBC available with different CPUs

Depending on the customer requirements, MSC offers the CXC-GS45 COM Express platform with different processor types. Full desktop computing performance can be achieved with the Intel Core 2 Duo SV SP9300 CPU clocked at 2 x 2.26 GHz. The low power version utilizing an Intel ULV Celeron 722 (1.20 GHz) with a thermal design power (TDP) of 5,5W is suited for fan-less, compact system designs and industrial applications. Alternatively, modules with the processors Intel Core 2 Duo LV SL9400 (2 x 1.86 GHz) or Intel Core 2 Duo ULV SU9300 (2 x 1.20 GHz) are available.

The Intel GS45 chipset integrates the Mobile Intel Graphics Media Accelerator 4500MHD including Clear Video Technology. Driving two displays with different content is supported via the Dual Independent Display Mode. The maximum resolution is 2048 x 1536 pixels. Analog VGA monitors as well as LVDS displays up to 2 x 24-bit can be connected. Other new features are support for DirectX 10 and OpenGL 2.0. High quality audio functionality is ensured via the Intel High Definition Audio interface.

The module offers connectivity to eight USB 2.0 ports, a PCI bus, a LPC bus, five PCI Express x1 lanes and one 10/100/1000 Base-TX Ethernet interface. In addition one PCI Express x16 (PEG) interface is also provided. Four SATA-2 channels with up to 300 MB/s and an Enhanced IDE port (ATA/UDMA166) are available for data storage. The memory can be expanded up to a capacity of 2 GBytes via a 200-pin SO-DIMM socket. The module also provides a power connector for a CPU fan allowing simple addition of active cooling units

The COM Express platform is equipped with hardware and BIOS based security functionality compliant to the requirements of the Trusted Computing Group (TCG). In addition to that, the Trusted Platform Module TPM 1.2 SLB 9635 from Infineon and furthermore, the SecureCore BIOS from Phoenix Technologies have been integrated. The modules run under Windows Vista, Windows XP (embedded) and Linux operating systems. Additional operating systems can be supported upon request. Evaluation baseboards are available for development support and design-in. Moreover, MSC offers design services for application-specific motherboards.

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