Configurable mixed-signal IC helps reduce automotive design size -

Configurable mixed-signal IC helps reduce automotive design size


Dialog Semiconductor plc has launched its first configurable mixed-signal IC (CMIC) for the automotive industry. The new SLG46620-A, part of the company’s GreenPAK platform, can replace dozens of components in automotive applications, which saves board space and reduces the bill of materials (BOM).

The GreenPAK CMICs enable OEMs to create base platforms that can be easily customized for the application without additional costs. This allows designers to select the right CMIC for their application and budget. In addition, the flexible platform can provide unified development flows, a faster time to market and lower project costs.

All of the automotive-grade GreenPAK base die parts can be programmed to implement multiple AEC-Q100 qualified ICs. Functionality includes power sequencing, voltage monitoring, system reset, LED control, frequency detection, and sensor interfacing.

Every custom, factory-programmed IC gets its own unique part number, top marking, datasheet and production part approval process (PPAP). The parts will be factory programmed and tested to ensure it meets functional specification to automotive reliability levels.

>> This article was originally published on our sister site, Electronic Products: “Dialog unveils configurable mixed-signal IC for automotive.”

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