congatec presents the world’s first embedded form factors with the brand new 8th Generation Intel Core Mobile processors at embedded world 2019. This launch of COM Express Type 6 Compact modules, 3.5 inch SBCs, and Thin Mini-ITX motherboards – all equipped with commercial-grade Intel Core i7-8565U Mobile processors – allows congatec to play a pioneering role in the rollout of this new processor generation for harsh and space-constrained environments.
The new hybrid embedded conga-JC370 3.5 inch SBCs, conga-IC370 Thin Mini-ITX motherboards and conga-TC370 COM Express Type 6 modules all come with the 1.8 GHz quad-core Intel Core i7-8565U Mobile processor that impresses with a performance increase of up to 40% compared to previous U-Series processors enabled by a leap from 2 to 4 cores along with the improved microarchitecture. The memory is designed to match this performance boost: Two DDR4 SODIMM sockets with up to 2400 MT/s are available for a total of up to 64GB. For the first time, USB 3.1 Gen2 is now supported natively. This USB SuperSpeed+ interface is capable of transferring up to 10 Gbps, which makes it possible to transfer even uncompressed UHD video from a camera to a monitor. The new 3.5 inch SBC provides this performance via a USB-C connector that also supports 1x DisplayPort++ and power supply for peripheral devices, thereby enabling monitor connection with a single cable for video, touch and power. The COM Express modules support the same feature set on carrier boards. Further interfaces depend on the form factor but all support a total of 3 independent 60Hz UHD displays with up to 4096×2304 pixels as well as up to 2x Gigabit Ethernet (1x with TSN support). The new boards and modules offers all this and many more interfaces with an economical 15W TDP, which is scalable from 10W (800 MHz) to 25W (up to 4.6 GHz in Turbo Boost mode).