congatec introduces its brand-new conga-TS370 COM Express Type 6 Computer-on-Modules in parallel with the launch of the 8th Generation Embedded Intel Xeon and Intel Core processors (codename Coffee Lake H). They propel the 35-45 W TDP class of COM Express Type 6 modules to a new ‘six-pack’ level of high-end embedded computing, offering for the first time up to 6 cores, 12 threads and an impressive turbo boost of up to 4.4 GHz and drive up to three independent 4k UHD displays. Initial tests from congatec indicate that these brand new six-core modules offer between 45 to 50 percent more multi-thread and 15 to 25 percent more single-thread performance, compared to 7th Gen Intel Core processor based variants. At a given TPD, system designs achieve higher bandwidth at overall lower power consumption ultimately leading to higher system efficiency. Target applications are high performance embedded and mobile systems, industrial and medical workstations, storage servers and cloud workstations, as well as media transcoding and edge computing cores.
Beside performance gains, the new congatec modules impress with extended long-term availability of 10 years plus, high bandwidth I/Os with 4x USB 3.1 Gen 2 (10 Gbit/s) and Intel Optane memory support, as well as enhanced security features including Intel Software Guard extensions, Trusted Execution Engine and Intel Platform Trust Technology.