congatec introduces its first Server-on-Module with AMD embedded server technology. The new conga-B7E3 Server-on-Module with AMD EPYC Embedded 3000 processor is currently the cutting edge of embedded server technologies, offering up to 52% more instructions per clock compared to legacy architectures. As Server-on-Modules form the technology basis for complementary rugged server designs, developers can use the new conga-B7E3 modules as a drop-in replacement to boost performance within their closed loop engineering design cycles in manifold rugged edge applications.
The new conga-B7E3 COM Express Type 7 modules are equipped with AMD EPYC Embedded 3000 processors with 4, 8, 12, or 16 high-performance cores, support simultaneous multi-threading (SMT) and up to 96 GB of DDR4 2666 RAM in the COM Express Basic form factor and up to 1TB in full custom designs. Measuring just 125 x 95 mm, the COM Express Basic Type 7 module supports up 4x 10 GbE and up to 32 PCIe Gen 3 lanes. For storage the module even integrates an optional 1 TB NVMe SSD and offers 2x SATA Gen 3.0 ports for conventional drives. Further interfaces include 4x USB 3.1 Gen 1, 4x USB 2.0 as well as 2x UART, GPIO, I2C, LPC and SPI.
Attractive features also include seamless support of dedicated high-end GPUs and improved floating-point performance, which is essential for emerging AI and HPC applications. congatec also offers advanced cooling solutions for its COM Express Type 7 Server-on-Modules that match the processor, support fanless cooling even beyond 65 W TDP, and can be adapted to customers’ housings, if required. This allows OEMs to integrate maximum processor performance into their designs, as performance is often limited by the system’s cooling capacity. OS support is provided for Linux and Yocto, as well as Microsoft Windows 10 and Windows Server.