congatec Inc.has launched its 5th generation Intel Core i7-5650U on COM Express Computer-On-Modules and Thin Mini-ITX motherboards. The single-chip processors feature low power consumption of just 15W TDP. Built on Intel’s new 14nm process technology, the 5th generation Intel Core processor is designed to provide excellent graphics and performance, supporting the next generation of congatec’s COM Express and Thin-Mini-ITX boards for Internet of Things (IoT) solutions, while maintaining compatibility with previous generations.
Both the COM Express module and the Thin Mini-ITX motherboard allow for the connection of up to three independent display interfaces via HDMI 1.4, LVDS and embedded DisplayPort (eDP). When using DisplayPort 1.2, the individual displays can be daisy chained to take advantage of simple wiring. Native USB 3.0 support provides fast data transmission with low power consumption. The two SODIMM sockets can be equipped with up to 16 GB SODIMM DDR3L memory.
The strength of the new powerful COM Express compact Type 6 module, the conga-TC97, lies in its flexibility and customization abilities for the application. A total of eight USB ports are provided, two of them support USB 3.0 SuperSpeed. Four PCI Express 2.0 lanes, four SATA ports with up to 6 Gb/s, RAID support and a Gigabit Ethernet interface enable fast and flexible system extensions.
The flat design of Thin Mini-ITX – measuring 25mm in height with I/O shield – enables flat housings, such as those required for panel PCs. Four USB 3.0 SuperSpeed ports are directly available on the I/O shield. A total of two 5 Gb/s PCI Express 2.0 lanes can be used as mPCIe Half Size and PCIe Full Size shared with PCIe x1 and mSATA. Fast and flexible system extensions are possible with four SATA interfaces with up to 6 Gb/s plus one mini PCIe. Two Intel I210 Gigabit Ethernet controllers each provide one Gigabit Ethernet LAN access via the two RJ45 sockets. The universal power source with 12 to 24 volts complete the feature set.