DesignCon 2013 abstracts due Monday, Aug. 27 - Embedded.com

DesignCon 2013 abstracts due Monday, Aug. 27

Calling all semiconductor and electronic design engineers: DesignCon 2013 abstracts are due Monday, August 27.

DesignCon's ChipheadThe last day to submit your abstracts to DesignCon 2013 is this Monday, August 27. The conference accepts three types of sessions: technical papers, panels, and tutorials. For information on what to submit and how, click here .

See the award-winning papers from the most recent DesignCon.

DesignCon 2013 will be held January 28 through 31 in Santa Clara, California next year. DesignCon is administered by UBM, the parent company of EE Times, Embedded.com, EDN, and DESIGN East and West (aka, the Embedded Systems Conference).

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