DesignCon 2015 extends its deadline for submissions - Embedded.com

DesignCon 2015 extends its deadline for submissions

With the Fourth of July festivities last week, the 2015 DesignCon conference organizers decided to give you an extra week to submit your abstract.

DesignCon gives chip, board, and systems design engineers the unique opportunity to gather for four days and learn the latest design techniques, methodologies, and tools around signal integrity, power integrity, high-speed serial design, PCB design tools, test and measurement, and more.

Be sure to join this elite group by offering your case studies, technology innovations, practical techniques, design tips, and application overviews. Submit your abstract for the chance to share your expertise in the areas of signal and power integrity, test and measurement, and verification.

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