DesignCon 2015 news, analysis and events round-up

To simplify (or perhaps complicate ) what events, classes , and venues attendees can take advantage of at the 2015 DesignCon in Santa Clara, Ca., Jan. 27 – 30, here is a round-up of news, blogs and analysis covering all aspects of the meeting.

DesignCon 2015: Why I’m going
Larry Desjardin  investigate architectural trends of bench instruments at DesignCon, the quintessential conference for hardware design engineers.

ANSYS previews chip-package-system analysis for DesignCon
Full system analysis is an absolute necessity to address the new challenges of system design. Margaret Schmidt from ANSYS explains why.

Cadence Demos Allegro Sigrity at DesignCon
DesignCon 2015 takes place January 27-30, where Cadence will showcases its Allegro Sigrity solutions for signal integrity and power integrity

Rambus announces DesignCon highlights
In addition to its space in the expo hall, Rambus will also be presenting four papers in the conference’s technical program and delivering a full-day training session.

Keysight Debuts at DesignCon 2015
DesignCon takes place January 27-30, where Keysight Technologies will make its first appearance after formally spinning off from Agilent Technologies

Tips to optimize high-speed serial design
Papers and presentations at DesignCon 2015 address critical areas of high-speed design. Here’s a preview of some of them.

Get a taste of SPICE at DesignCon
Every engineer needs easy access to a SPICE simulator tool. Get introduced to possibly the world's best SPICE tool at a DesignCon speed training event.

Get a closer look at parallel and DDR interfaces
Want the latest design techniques to meet the performance requirements for chip-to-chip interfaces? Check out this DesignCon track.

DesignCon enlightens attendees on wireless and photonic integration
The Wireless and Photonic Integration track includes a panel that will introduce silicon photonics technology, a paper presentation that will discuss a reliable methodology for analyzing the noise coupling mechanism in an IC package, and more.

Materials and fabrication affect electrical performance
DesignCon conference track looks at the effect of materials and fabrication on electrical properties and performance, here are some papers not to miss.

PCB design tools track covers DDR4, differential crosstalk at DesignCon
This DesignCon track explores effective high-speed design and design choices using a wide range of E-M modeling techniques, PCB characterization tools, and test platforms to optimize PCB platforms.

PAM4 takes the spotlight at DesignCon 2015
PAM4 signaling has threatened to take the reigns from NRZ for years, but this time it's really going to happen. Find out how our concepts of signal integrity will have to change at the Case of the Closing Eye, opening night, DesignCon 2015.

DesignCon signal and power integrity track tackles noise
One of the highlights of DesignCon is the conference tracks are selected by more than a hundred engineers who are passionate about the content. Here is a preview of the signal and power integrity track.

DesignCon signal modeling and simulation track includes random jitter
If you're interested in the challenges of analog and mixed-signal modeling and simulation, there is a DesignCon track for you.

Impedance measurements make a difference at DesignCon
What do clock jitter, EMI, control loop stability, SPICE modeling, rogue waves and the ripeness of fruit have in common? A tutorial and paper presentation at DesignCon may be just what you need to find out.

DesignCon brings chip, package and board modeling together
This DesignCon track covers a broad range of topics addressing design-oriented modeling simulation and analysis for cost-effective power and signal integrity performance optimization of chip/package/board/chip+package+board for modern microprocessor/digital systems.

Be prepared for optical backplane and circuit protection
Will the optical backplane ever happen? Are you adequately protecting your circuit designs? Be prepared with these two DesignCon panels.

DesignCon 2015 revs up for high speed interconnects
The world's top engineers will be at DesignCon talking about pedal to the metal engineering and what is next in high speed serial links.

DesignCon 2015: Focus on test and measurement
Get a preview of some test equipment you'll see at DesignCon 2015.

Tips to optimize high-speed serial design
Papers and presentations at DesignCon 2015 address critical areas of high-speed design. Here’s a preview of some of them Site Editor Bernard Cole is also editor of the twice-a-week newsletters as well as a partner in the TechRite Associates editorial services consultancy. If you want to see a calendar of topics for the weekly Tech Focus newsletter or have a topic you would like to see covered, he welcomes your feedback. Send an email to , or call 928-525-9087.

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