Digi International will showcase its ConnectCore 8X system-on-modules and single board computers, and the Digi XBee3 series of modules and modems at Embedded World 2019. Additionally, Digi will host demonstrations and educational sessions that will illustrate the latest in embedded technology and its capabilities.
At the event, Digi will introduce ConnectCore 8X development kits, which are designed to provide hardware and software engineers, corporate technologists, and even educators and students with the opportunity to gain hands-on experience in integrating connectivity into their IoT solutions and applications.
Digi’s extremely small, Digi SMTplus form factor ConnectCore 8X SOM and SBC utilize the NXP i.MX 8X family based on ARM Cortex-A35 and Cortex-M4F cores. Designed for ultimate reliability and design freedom, the ConnectCore 8X offers 2X2 MIMO 802.11ac + Bluetooth Smart connectivity, graphics, video, image processing, audio/voice capabilities, as well as Digi TrustFence security for advanced IoT applications for highly regulated sectors including medical/healthcare, transportation, building automation, advanced HMI, and industrial.
The Digi XBee3 series of smart edge RF modules and cellular modems are highly integrated, compact and designed to support IoT innovation at the network edge. With a modular approach to IoT connectivity, the Digi XBee3 series enables the integration of new functions with MicroPython programmability, dual-mode radios and the ability to upgrade firmware over-the-air. These functionalities enable wireless design flexibility, cost-effective integration and easily added custom business logic at the network edge. The result is innovative IoT solutions that can be more quickly developed, prototyped and mass-produced.