Display controller supports mobile processor interface spec - Embedded.com

Display controller supports mobile processor interface spec


San Jose, Calif.—Toshiba America Electronic Components Inc. (TAEC) launched the TC358730XBG, a display buffer/controller that the Japanese chip maker claims is the industry's first controller to support the high-speed Mobile Industry Processor Interface (MIPI) Display Serial Interface (DSI) specification.

For more on MIPI, go to www.mipi.org

The TC358730XBG's introduction is part of the company's Mobile Strategic Initiative it announced last month aimed at providing U.S.-based mobile handset makers with discrete-analog and mixed-signal building blocks that provide the connectivity between the baseband chip and various functions, including the display, camera, keypads and external storage devices.

The TC358730XBG is based on the core architecture of the existing Toshiba MDDI bridge-client device (TC358720XBG). For more on the TC358720XBG, click here.

The TC358730XBG reuses the TC358720XBG's core architecture, replaces the MDDI-host interface with a MIPI-compliant interface and adds a high-speed, serial-output interface.

The TC358730XBG features 8-Mbit of embedded DRAM (eDRAM) to provide flexible image buffering for displays with up to VGA resolution. It provides single-buffer operation for images with up to VGA resolution, and automatic double buffering when handling two images with resolutions up to HVGA.

Designed for use across a variety of mobile phone platforms, the TC358730XBG supports the existing MIPI DBI type-B specification for command and video data and the MIPI DPI specification for video data plus the MIPI DBI type-C baseband-interface standards for command data.

The controller also supports the upcoming high-speed serial MIPI DSI baseband interface for command and video data. It provides LCD-module interface support for parallel MIPI DPI interfaces as well as for a common high-speed serial interface.

The TC358730XBG is packaged in a 64-pin BGA with dimensions of 5mm x 5mm x 1mm.

Pricing: Sample pricing is projected to be in the range of $20.00 to $25.00 each in 10,000-piece quantities.
Availability: Sampling to select customers now. Volume production is planned to start in the second half of 2007.
Data Sheet: Not yet available.

Toshiba America Electronic Components, Inc., 1- 949-455-2000, chips.toshiba.com.

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