First modular Micro-ATX compliant carrier board with COM-HPC interface now supports OEMs looking to develop designs lasting at least 7 years,
As the industry converges again on embedded world 2022 in Nuremberg for the first time in two years, one key theme is the increasing intelligence being moved from cloud to edge but with a continuum of compute between them.
High performance embedded computing researchers and industry re-convene for the first time in person at Budapest, Hungary event, since they last gathered at Bologna, Italy in January 2020.
Our weekly roundup from the embedded world includes news from Arduino, DSP Concepts, Flex Logix Technologies, Infineon Technologies, LG Electronics, RealVNC, Rohde & Schwarz, SiLC Technologies, Sony Semiconductor Solutions Corporation, and STMicroelectronics.
Latest version of IICF expands connectivity guidance to include lightweight, resource-constrained M2M devices. It defines an IIoT communications stack and a connectivity assessment template and provides guidance on selecting the right connectivity standard.
Solution unlocks the potential of the significant volumes of EDA metrics and design-flow data, heralding a new era in smarter IC design by deploying an expanse of advanced data analytics and targeted machine learning to effectively guide design teams.