DTI to fund NPL encapsulant investigation - Embedded.com

DTI to fund NPL encapsulant investigation


Teddington, UK — The Department of Trade & Industry (DTI) is to fund a project to improve understanding of the protection mechanisms of encapsulants and conformal coatings for electronic protection.

The National Physical Laboratory says its investigations have already found common misconceptions that moisture exclusion is a key role of conformal coatings. The NPL believes that there is a growing need to better understand methods of electronic protection as electronics find increasing application in harsh and exotic environments from automotive to medical, drilling to aviation.

Techniques focused on changes in coating mass, permeability and insulation properties will be used whilst assemblies are exposed to heat, moisture and aggressive agents representative of end-use conditions.

The lifetime of electronic assemblies is critically dependent on the performance of encapsulants used and thus increasing electronic product lifetime. For information on the project see the NPL web site.

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