Tiny eSIM offers cellular connectivity for IIoT
Infineon Technologies AG claims the industry’s first industrial-grade embedded SIM (eSIM) in a miniature wafer-level chip-scale package (WLCSP) for reliable data connections and transmissions in industrial internet of things (IIoT) and machine-to-machine (M2M) applications. The WLCSP measures 2.5 × 2.7 mm.
The eSIMs allow for cellular connectivity in industrial environments, enabling data to be exchanged to manage production processes over a cellular network in a small footprint, delivering additional design flexibility. Customers also can change their mobile service provider at any time for any reason, whether it’s for a better service contract or due to deterioration of network quality.
The SLM family (SLM37, SLM97, SLM76) offers 16-bit and 32-bit security controllers for industrial applications. The devices operate over an extended temperature range of –40°C to 105°C for demanding usage conditions such as smart metering, vending machines, and asset tracking. The product line is compliant with the latest GSMA specifications for eSIM.
In addition, the devices are offered as a single SKU, simplifying manufacturing processes and global distribution. The chip is available in volume quantities.
>> This article originally appeared on our sister site, Electronic Products: "Industrial-grade embedded SIM comes in tiny WLCSP."