Collected here are my Editor’s Top Picks of embedded industry product and technology news stories for the week of Dec. 1 – 5, 2014:
The migration of “faceless” test instruments from the production floor to the test bench or even to the engineer's office that began this year will continue in 2015.
The result of a convergence of LED technology, smart objects and the effect of light on our moods and health, smart light (AKA human centric lighting), may get a lot more attention in 2015.
Micrium is working with the German specialist in safety critical embedded systems on prepackaged certification kits for industrial,medical and railway applications
ASIX Electronics Corp. has launched five AXB series embedded Bluetooth modules for Internet of Things applications and wireless audio applications.
Flasher PRO from SEGGER is a programming tool for microcontrollers with on-chip or external Flash memory and ARM, RX or PPC core.
Atmel Corporation has launched its next-generation family of local interconnect networking (LIN) transceivers, system basis chips (SBC), and voltage regulators for automotive body, power-train, infotainment sensor, and actuator applications.
Microchip Technology Inc. has announced the completion of its high-accuracy, 1-8 channel, single and poly-phase MCP391X energy-measurement Analog Front End (AFE) family.
Microchip has launched a new family of 16-bit dsPIC33 Digital Signal Controllers (DSC).
Imagination Technologies has developed new tools designed to provide everything needed for MIPS software development across the entire product lifecycle, from SoC design and integration through SoC bringup to end product.
eSOMiMX6 is a ready-to-use system-on-module using Quad, Dual or Solo ARM Cortex A9 Processor running up to a speed of 1.2GHz.
Embedded news from around the Web
Hot Technologies Looking Ahead to 2015
Hot Tech 2015 – GaN The dawn of a new era
Hot Tech 2015 – What Fascinations Will 2015 Hold for FPGAs
Winnie the Pooh on Sustainable Cyberinfrastructure
A 10x Gap Between Best and Average Programmers?
Avoiding MQTT pitfalls
Tips for home automation IoT design
8 attributes IoT gateways need
UHF could usher in 'super-Wi-Fi'
Quo Vadis, Indoor Location
Project simplifies multicore software development
Intel X86 Eyes Google Glass
The Spec Dilemma
Long Live the News Release
Conductive Clay — the Future of Energy Storage
Embedded.com Site Editor Bernard Cole is also editor of the twice-a-week Embedded.com newsletters as well as a partner in the TechRite Associates editorial services consultancy. If you want to see a calendar of topics for the weekly Tech Focus newsletter or have a topic you would like to see covered, he welcomes your feedback. Send an email to , or call 928-525-9087.