Collected here are my Editor’s Top Picks of embedded industry product and technology news stories for the week of June 16 – 20, 2014
RTI's Connext DDS Secure assures secure M2M in critical systems
Real-Time Innovations (RTI) has introduced the first secure messaging software designed for critical industrial systems.
GE's new 3U VPX SBC delivers higher performance
GE Intelligent Platforms' SBC346 Rugged 3U VPX Single Board Computer offers significantly higher levels of performance.
Spansion launches PMICs for IoT energy harvesting
Spansion Inc. has launched a new family of power management integrated circuits (PMICs) for energy harvesting that can enable a greener Internet of Things (IoT) by eliminating the need for batteries in IoT devices
VirtualBench offers five essential instruments in a single device
VirtualBench from National Instruments is an all-in-one instrument that integrates a mixed-signal oscilloscope, function generator, digital multimeter, programmable DC power supply and digital I/O.
TRACE32 exports trace data for external timing analysis
Lauterbach has added a new feature to its TRACE32 tools that exports task event-based trace data for external timing analysis.
1.8V STM32 MCUs bridge mobile platform subsystems
The latest STM32 microcontrollers from STMicroelectronics are specific low-voltage devices that help overcome the challenges designers face when adding a companion chip to a low-voltage host processor.
Axiomtek announces compact, fanless Pico-ITX SBC
Axiomtek’s PICO121 is an extremely compact fanless Pico-ITX SBC with ultra-low power AMD G-Series Embedded SoC GX-210JA dual core 1.0GHz onboard.
Radiometrix SFX2 radio transceiver module has long range for industrial apps
The new SFX2 radio Transceiver module from Radiometrix Ltd. is targeted for industrial applications requiring long range and high-reliability.
Vicor High Density (HD) Bricks ramp up to 51% greater power density
VicorCorporation announces that its new isolated DC-DC HD Bricks provide up to 51% greater power density than competing brick products, with efficiency levels up to 94%.
New GUI eases semiconductor IP integration for heterogeneous multicore SoCs
Sonics, Inc. has introduced its next-generation SonicsStudio development environment that addresses the integration challenges of complex system-on-chip (SoC) designs that include multiple processor and intellectual property (IP) cores.
Maxim tries its hand at a programmable analog arrays
Taking one step back in order to take several forward, Maxim Integrated Products this week introduced its MAX11300 Programmable Mixed Signal I/O (PIXI) device.
Davra Networks debuts “breakthrough” end-to-end IoT management platform
The company's new RuBAN is designed for connectivity management tasks for everything from utilizing ‘fog computing’ to collecting data from sensors to presenting it as usable intelligence on the desktop.
PrismTech brings its all-in-one IoT device cloud services integration tool
At the IoT World conference this week in Palo Alto, Ca., the company took the wraps off its Vortex Data-Sharing Platform for Internet of Things-based business systems
SiTime re-engineers its MEMS oscilattors for weearables and IoT
It has a new temperature compensated oscillator based on its MEMS fabrication technology that will be a good fit for the smaller size and longer battery life of nextgen internet of Things and wearable devices.
Analog's new Blackfin DSPs target power sensitive sensor apps
Analog Devices has just introduced its ADSP-BF70x family of high-performance Blackfin DSP targets end point processing applications on a variety of wireless sensor networks and mobile devices.
A new approach to auto infotainment display from Bosch
Bosch Group proposes heads-up “combiner” infotainment display that flashes crtical information into the driver's field of vision on the road ahead
Embedded news from around the Web
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Neuroscientists Join the Open-Source Hardware Movement
Can copper wires be transformed to become batteries –
Is China the World’s Leading Cyberspy