Collected here are the Editor’s Top Picks of Embedded industry product and technology news stories for this week:
Microchip's new dsPIC DSCs enable dual motor control
A new family of dsPIC33 Digital Signal Controllers (DSCs) from Microchip enables dual motor control with 12 motor control PWM channels (6 pairs), dual 12-bit ADCs, multiple 32-bit Quadrature Encoder Interfaces, and two CAN modules.
HALCON and VisualApplets speed dev for Xilinx Zynq-7000 SoCs
Xilinx, Inc. has announced HALCON and VisualApplets development platforms to create an end-to-end Smarter Vision development environment for the Zynq-7000 All Programmable SoC.
Microchip’s new front end module extends ranges
Microchip Technology Inc. has released the the SST12LF09, the company's latest 2.4 GHz, 50 ohm Matched RF WLAN Front End Module (FEM) for Bluetooth connectivity.
CEL offers high temp ZigBee modules
New MeshConnect EM357 High Temperature Mini Modules and MeshConnect EM357 USB Sticks are both powered by the premier ZigBee PRO stack from Silicon Labs. http://embedded.com/electronics-products/electronic-product-reviews/connectivity/4424582/CEL-offers-high-temp-ZigBee-modules
Agilent's new PCIe high-speed digitizer samples up to 2GS/s
The new U5309A 8-bit PCIe digitizer from Agilent Technologies samples up to 2GS/s and features two channels with an analog bandwidth from DC to 500 MHz. http://embedded.com/electronics-products/electronic-product-reviews/mcus-processors-and-socs/4424788/Agilent-s-new-PCIe-high-speed-digitizer-samples-up-to-2GS-s
Qualcomm pairs dual-core Krait and packet CPUs for smart homes
Qualcomm Internet Processor (IPQ) product line aims to transform networking devices like home gateways, routers and media servers into “Smarthome” platforms.