Embedded news: Week of Sept. 1 - 5, 2014 - Embedded.com

Embedded news: Week of Sept. 1 – 5, 2014


Collected here are my Editor’s Top Picks of embedded industry product and technology news stories for the week of Sept. 1- 5, 2014.

Silicon Labs IoT kits speed enviromental/biometric sensor design
Targeting the real-world wireless sensor based Internet of Things, SiLab's pair of develpment kits are for speeding up the implementation of a variety of enviro and biometric sensing desig

Intel wearables challenge goes new age
Intel Corp. has announced the finalists in its “Make It Wearable” challenge, the winner of which will in November win $500,000.

Andes gets ready to take on ARM/Android
Even with ARM reigning as king of the CPU IP market and Android dominating mobile operating systems, Taiwan-based Andes Technology thinks there is room for new architectures.

An Android Wear wearables Slideshow
A slideshow of real-world examples of almost-ready-to-ship Android Wear devices Google has rolled out.

New App brings iPhone access to Modbus TCP I/O modules
Available on the iPhone, iPad, and iPod Touch, Sealevel's Modbus Connect allows a developer to configure its Modbus devices remotely.

10 cheap (mostly Android) moble engineer app tools
A slideshow of some of the many engineering apps available on mobile phones and devices.

HVEC, VP9 in close battle for video codec leadership
The battle between HEVC and VP9 for video codec dominance will be close with room in the market for both – at least in the short term.

When is a subsystem not like Intellectual Property?
An understanding of what makes subsystems more than just “bigger IP,” will help embedded developers implement better, more effective and lower cost system-on-chip designs.

Imagination's MIPS I-class I6400 CPUs boast multi-threading, multicore, multi-cluster processing
The MIPS I-class I6400 CPU family from Imagination Technologies are the first IP cores to combine a 64-bit architecture and hardware virtualization with scalable performance through multi-threading, multicore and multi-cluster coherent processing.

NXP's NTAG I²C offers NFC interaction with any electronic device
NXP Semiconductors announced a complete passive solution for near field communication (NFC) interaction for a wide variety of applications such as home appliances, consumer electronics, wearable technology and home automation.

Eurotech's DynaGATE 15-10 gateway and edge controller targets transportation apps
The DynaGATE 15-10 from Eurotech is a multi-service gateway and edge controller designed to meet transportation industry requirements.

Allegro's galvanically isolated current sensor IC boasts differential output
Allegro Microsystems claims that its ACS726 is the first current sensor IC to include a fully differential back-end amplifier that can be used to adjust gain and bandwidth via external RC networks.

Broadcom announces WICED Sense dev kit for IoT apps
Broadcom Corporation's WICED Sense development kit is an all-in-one IoT prototyping kit.

Renesas new R-Car device offers high-res image recognition for driver assistance systems
The R-Car V2H from Renesas Electronics Corporation is the company's newest system-on-a-chip (SoC) implementing state-of-the-art image recognition technology to support high-resolution surround viewing in advanced driver assistance systems (ADAS).

Embedded news from around the Web  

Nanopower Magnetoresistive Sensor ICs push the envelope on sensitivity
MIPS Moves Multicore Battle to Clustering
3G-4G Rising for M2M
Engineering Glossary Farnell UK
Engineers Pioneer Future at Freescale Discovery Lab
Turning off the tick in the RTOS cuts MCU power consumption
First Look at Testing MIPI's Latest PHY
9 World Maker Faire makers not to miss
The Internet of Things Meets the Internet of Cars
3 Tips for IoT App Development
IoT Transforming the Lighting Industry
Wearable Devices Keep Data Privacy in Check
Test suite carries out CE compliance test
Wireless charging-NFC reference design
Imagination Takes On Raspberry Pi

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