LONDON The IEE/FSA Semiconductor Executive Forum is to look at tensions in the semiconductor supply chain which have been fuelled by the chip industry upturn, China's plans to increase IC manufacturing capacity and upcoming IPOs.
Organised jointly by the IEE and the Fabless Semiconductor Association (FSA), the Forum will take place on 7 and 8 September 2004 at IEE Savoy Place, London and will bring together leading executives, industry analysts, senior engineers, venture capitalists, investment bankers and media.
Keynote speakers will include Sir Robin Saxby, Chairman of ARM, and Dr. Tsai, President and COO of TSMC, Jen-Hsun Huang, President and CEO, NVIDIA; Dr Sanjay Jha, President, QUALCOMM CDMA Technologies; and Pascal Ronde, Vice-President, Worldwide Sales and Marketing, ATG Group, Agilent Technologies.
Highlights will also include analyst sessions by Gartner, iSuppli, and Merrill Lynch, as well as panel sessions on how China's arrival in the foundry business has affected the international market and how fabless companies and integrated device manufacturers (IDMs) manage their relationships with foundries.
There will also be a discussion on the future of the industry, as the foundries seek to meet rising demand against the backdrop of boom-to-bust industry cycles.
There will also be executive level presentations from a number of companies including Amkor Technology, Broadcom, CEVA, Conexant, Chartered Semiconductor, eSilicon, Mentor Graphics, PicoChip, Pintail, Oxford Semiconductor, Philips, SMIC, STMicroelectronics, Synopsys, Tower Semiconductor, Tundra Semiconductor, Wolfson Microelectronics and Zentian.