LONDON The SMART Group, with support from the LEADOUT European Lead-Free Research Project, has launched the Lead-Free Experience 4 Report, from the practical work carried out at the recent Nepcon Electronics Show.
This document should be useful for small and medium volume manufacturers in using lead-free materials and production equipment. Engineers at the show had the opportunity to gain practical process experience on lead-free soldering, inspection, component requirements, printed circuit board design/specification and product reliability and the process parameters and results obtained have been compiled to form this report.
“Gathering all the data from the initial rigid and flexible circuit board trials and comparing the results each year provides a practical guide to engineers new to lead-free, ” said Bob Willis, the project's organizer. “The report provides invaluable process material to companies embarking on the WEEE and RoHS rollercoaster ride. Looking at the report you can see the most consistent solder finish, the regular process problems and how to avoid them and of course what lead-free solder joints really look like in production.”
The report combines the results from this year’s project and the three previous events, detailing at a practical level, printed board design, lead-free component testing, PCB solder finishes, stencil printing, soldering materials, wave soldering; convection/vapour phase reflow and lead-free process defects.
The 100 page Experience Report along with the Process Technology Seminars are available for download as a pdf from the SMART Group web site.