IEDM: Intel’s low leakage 22-nm tri-gate SoC

SAN FRANCISCO — Intel described its 22-nm tri-gate (FinFET) SoC technology for mobile applications Monday at the International Electron Devices Meeting (IEDM) here.

The chip maker introduced a CPU version of its 22-nm offering in June, but Intel senior fellow Mark Bohr said in an interview that the recipe has been tweaked in order to scale down to a more mobile, ultra-low leakage version.

The change means Intel will now be able to boast product support from high performance servers down to cell phones on a tri-gate 22-nm process, with transistors covering a wide range of performance barriers.

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