IEDM: Moore’s Law hits a speed bump at 14 nm - Embedded.com

IEDM: Moore’s Law hits a speed bump at 14 nm

SAN FRANCISCO – Chips made at the 14-nm process node may deliver as little as half the typical 30 percent performance increase—and still carry a hefty cost premium–due to the lack of next-generation lithography needed to make them efficiently, according to experts speaking at the International Electron Devices Meeting (IEDM) here on Monday.

Chip makers must choose lithography options now for 14-nm node, two generation away from the 28-nm node in wide production for today’s smallest devices. But it will not be until 2014 that extreme ultraviolet (EUV) lithography tools will be available for limited commercial use.

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