NUREMBERG, Germany Congatec AG and SECO Srl have jointly created the Qseven form factor for use in embedded computing using the latest low power chipsets such as Intel’s Menlow platform.
Targeting next generation embedded processors built using 45nm technology, Qseven format is a board measuring 70 x 70mm and a maximum power consumption of around 12W.
Where heat dissipation is an issue, a thermal cooling interface has been defined to help transfer any heat generated to a cooling solution.
It will also provide connectivity through industry standard interfaces, including: 4x PCI Express; 2x SATA; 6x USB 2.0; 1x 1000BaseT Ethernet; 2x SDIO 8 bit; LVDS 2x 24 bit; DVO/SDVO (shared); video input port (VIP); high definition audio (HDA); I²C bus; and low pin count bus.
By leveraging the Mobile PCI Express Module (MXM) connector format, Qseven offers three different connector heights, from 4.3mm to 7.8mm. Through this configuration it is hoped the Qseven platform will be as simple to integrate as a DIMM memory module.
Congatec (Deggendorf, Germany) and SECO (Arezzo,Italy) are extending an invitation to vendors to join its open consortium and plan to release a general specification by the end of April, with a full Design Guide available by May 2008.