HYPERRAM—the expansion memory for scratchpad and data buffering—has reached its third generation and is ready to serve a wide range of applications such as video buffering, factory automation, artificial intelligence (AI) edge processing, and automotive vehicle-to-everything (V2X) communications. The third generation of HYPERRAM devices from Infineon Technologies support the newly extended HyperBus interface to enable 800 MBps data rates at a density range of 64 Mb to 512 Mb.
“The new HYPERRAM 3.0 memory solutions achieve a far higher throughput-per-pin than existing technologies in the market such as PSRAMs and SDR DRAMs,” said Ramesh Chettuvetty, senior director of applications and marketing at Infineon’s Automotive Division. Infineon’s HYPERRAM device is a standalone PSRAM-based volatile memory that offers a simple way to add extension memory.
Chettuvetty adds that data rates are equivalent to SDR DRAM but have much lower pin-count and power requirements. “The increased per-pin data throughput of the HyperBus interface makes it possible to use MCUs with fewer pins and PCBs with fewer layers.”
It’s important to note that DRAMs entail high pin count and high-power consumption. On the other hand, SRAMs offer lower density at a higher cost. In the space between SRAM and DRAM, there are pseudo-SRAMs (PSRAMs) and SDR DRAMs, which are high-throughput devices. However, while DRAMs keep migrating to higher densities, low-density DRAMs don’t make financial sense anymore, said Infineon’s Bobby John.
As a result, the low-density DRAM market is shrinking over time. But there are still niche applications that require lower densities, which DRAM used to cater to. Here, HYPERRAM expansion memory, featuring a low pin-count interface, provides high throughput as well as low power consumption. According to John, in a throughput per pin metric, HYPERRAM can achieve much a higher throughput.
HYPERRAM use cases
According to Shivendra Singh, lead principal engineer at Infineon Technologies, HYPERRAM is a sweet spot for any MCU that needs expansion RAM as well as high data throughput, especially when DRAM manufacturers are moving toward higher densities.
That’s why HYPERRAM expansion memory is getting a lot of traction in industrial automation environments where the addition of sensors is leading to a significant increase in processing and the need for local storage before processing.
Singh added that the need for buffering in AI-centric use cases is also driving the requirement for more data processing memory. In automotive, he specifically mentioned information cluster and body control applications, where HYPERRAM is getting traction due to the need for more memory for processing.
Infineon’s HYPERRAM 3.0 devices are available in a BGA-49 package.
>> This article was originally published on our sister site, EDN.
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