Manufacturing investment starts to pay off - Embedded.com

Manufacturing investment starts to pay off

Whitchurch, UK — An investment last year of nearly half a million pounds in production equipment at electronics design and manufacturing company CIL, is paying off with an expanding customer base and a 40% increase in turnover.

During 2003, CIL installed a new flying probe tester, a BGA rework facility, an in-line solder printer, three Tyco surface mount placement machines and an Opus 3 selective solder line.

John Boston, CIL's managing director, explained, “An essential part of our expansion plan was to concentrate on applications that require technically complex manufacturing techniques where our high level of skill and expertise gives us a competitive edge over off-shore manufacturing companies.

This new equipment allows CIL to provide surface mount manufacture and electronic assembly for BGA, QFP, 0603 and 0402 components, chip and wire, thick film, conventional assembly including hand/wave soldering and selective soldering. Up to 64,000 components an hour can processed.

The purchase of an X-ray test facility for BGA manufacture is already planned for early in 2004.”

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