MCPs combine NAND flash with DRAM - Embedded.com

MCPs combine NAND flash with DRAM

Micron Technology has developed a line of multi-chip package (MCP) memory for use in feature-rich mobile phones. Driven by the need for increased speed, extended functionality, and reduced package size, feature-rich 2.5G and 3G handset designs require flexible, high-capacity memory subsystems. The package combines Micron's NAND flash memory with its Mobile DRAM featuring Endur-IC technology. Endur-IC leverages the company's advanced stacked processes and a combination of other unique design methodologies to deliver low power, high quality, high reliability, and overall robustness.

The devices are currently sampling and will be available in 1-Gbit NAND/512-Mbit Mobile DDR DRAM configurations for production in the fourth quarter. To learn more, visit www.micron.com/mobile.

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