Battling for smartphone chip market share with the likes of NVIDIA, Samsung and Qualcomm, MediaTek is expected to enter the market early next year with its new MT6589.
The new quad-core ARM Cortex-A7 based smartphone SoC that integrates a HSPA+ modem and PowerVR Series5XT graphics. It is manufactured with 28nm technology and supports video playback and recording at resolutions of 1080p and 30 frames per second, with the promise of further to optimize energy use. The SoC connectivity revolves around Wi-Fi 802.11n, GPS, FM, and Bluetooth4.0.
The new quad-core SoC integrates MediaTek’s advanced multi-mode UMTS Rel. 8/HSPA+/TD-SCDMA modem, a power-efficient quad-core Cortex-A7 CPU subsystem from ARM, PowerVR Series5XT GPU from Imagination Technologies, and is delivered in 28nm process technology.
The company claims it is the first HSPA+ smartphone platform supporting Dual-SIM, Dual-Active functionality to address increasing multi-SIM demand around the world.
The integration of these compelling features makes the MT6589 a universal platform that delivers premium multimedia capabilities with extremely low power consumption for an outstanding user experience. It also enables handset makers to reduce time to market, simplify product development and manage product differentiation in a more cost effective way, for any market worldwide.
The MediaTek MT6589 quad-core solution supports 1080p 30fps/30fps low-power video playback and recording, a 13MP Camera with Integrated ISP, up to FHD (1920×1080) LCD displays, and enhanced picture processing for DTV-grade image quality.
In addition, the MT6589 also supports MediaTek’s “Cool 3D” suite, which includes support for stereo 3D cameras and displays, real-time 2D-to-3D conversion and an optimal 3D user interface.
Leveraging MediaTek’s established 3D technologies from the DTV and Digital Home markets, this suite helps create an optimal stereo 3D display with a custom-tailored 3D interface, providing an extremely flexible platform for product differentiation.
The MT6589 also supports Miracast technology for multi-screen content sharing and pre-integrates MediaTek’s leading 4-in-1 connectivity combo, which supports 802.11n Wi-Fi, BT4.0, GPS and FM.
The first smartphone models based on this new chipset are expected to ship commercially in Q1 2013.