Multi-sensor kit simplifies cloud connectivity -

Multi-sensor kit simplifies cloud connectivity

Dialog Semiconductor recently unveiled a new 15-degrees-of-freedom (DOF) SmartBond Multi-Sensor kit at Sensors Expo 2018, held in San Jose, California. The kit, which claims to offer simple ways for sensors to connect to the cloud with low power use and a small footprint, is built on Dialog’s DA14585  SmartBond system-on-chip. Dialog touts that the new kit is the lowest-power wireless sensor kit available today and supports more sensors than any other kit.

The sensor kit comes equipped with Bluetooth wireless communications, an Arm Cortex-M0 processor with accelerometer, gyroscope, magnetometer, and environmental sensors to reduce development time. According to the website, the sensor kit is suitable for use in smart tags/beacons, cloud-connected wireless sensors, asset tracking, voice-controlled sensor reading, voice-controlled actuator settings, wearables, immersive gaming, augmented reality, 3D indoor mapping/navigation, and weather stations.

Developers will be able to collect a variety of environmental data, which includes things like temperature, humidity, gas concentrations, motion, light, sound, and magnetic field. In a press release, Dialog notes that the kit is well-equipped for projects working on accelerated time-to-market deadlines as well as rapid prototyping schedules.

In addition, the kit is highly customizable with software that is easily tailorable to allow for use in a variety of applications and updates remotely via Software-Upgrade-Over-the-Air (SUOTA) functionality.

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